JPS61163649A - アウタ−リ−ドボンデイング装置 - Google Patents
アウタ−リ−ドボンデイング装置Info
- Publication number
- JPS61163649A JPS61163649A JP60004122A JP412285A JPS61163649A JP S61163649 A JPS61163649 A JP S61163649A JP 60004122 A JP60004122 A JP 60004122A JP 412285 A JP412285 A JP 412285A JP S61163649 A JPS61163649 A JP S61163649A
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor
- theta
- outer lead
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000001514 detection method Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 abstract description 12
- 238000003909 pattern recognition Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60004122A JPS61163649A (ja) | 1985-01-16 | 1985-01-16 | アウタ−リ−ドボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60004122A JPS61163649A (ja) | 1985-01-16 | 1985-01-16 | アウタ−リ−ドボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61163649A true JPS61163649A (ja) | 1986-07-24 |
| JPH0226379B2 JPH0226379B2 (en]) | 1990-06-08 |
Family
ID=11575980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60004122A Granted JPS61163649A (ja) | 1985-01-16 | 1985-01-16 | アウタ−リ−ドボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61163649A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222835A (ja) * | 1988-07-12 | 1990-01-25 | Toshiba Corp | 電子部品の実装装置 |
| US4913335A (en) * | 1988-09-01 | 1990-04-03 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for die bonding |
| US5609292A (en) * | 1992-12-04 | 1997-03-11 | International Business Machines Corporation | Manufacturing circuit boards using a pick and place machine |
-
1985
- 1985-01-16 JP JP60004122A patent/JPS61163649A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222835A (ja) * | 1988-07-12 | 1990-01-25 | Toshiba Corp | 電子部品の実装装置 |
| US4913335A (en) * | 1988-09-01 | 1990-04-03 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for die bonding |
| US5609292A (en) * | 1992-12-04 | 1997-03-11 | International Business Machines Corporation | Manufacturing circuit boards using a pick and place machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226379B2 (en]) | 1990-06-08 |
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